Product Engineer
- OMNIVISION
- Yokohama, Japan
- JPY 8,000,000 – JPY 12,000,000
Responsibilities:
- Product engineer responsible for CMOS image sensor
- Schedule a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve different technical issues, in order to meet performance requirements.
- Participate in product definition and provide DFM inputs.
- Work in close collaboration with silicon foundry, image characterization, and pixel design.
- Interact with foundry fab in improving all silicon process, color, and package issues.
- Improve product yield and performance by process optimization and layout design update.
- Analyze yield and drive corrective actions for yield improvements.
- Drive characterization to finalize the product datasheet.
- Work with pixel design group to design the most sophisticated and optimized pixel layout.
- Collaborate with characterization team to analyze and debug pixel device circuit and various image related issues.
- Ramp up for image sensors and ASIC devices.
- Coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes.
- Work with testing engineers to develop, verify, and release testing program at wafer level testing and final testing.
Qualifications:
- 5+ years experience with product engineer for semiconductor
- Knowledge about semiconductor
- Good communication and inter personal skills (English and Chinese ; business level, Japanese ; conversational level)
- Result oriented and leading change behaviors
- Experience / knowledge in CMOS Image Sensor is a plus
- Project management experience with solid skill is a plus
- Education: B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Material Science (or equivalent practical experience).
Skills
- CMOS Image Sensors
- Semiconductor Process
- Yield Analysis
- Characterization
- DFM
- Wafer-Level Testing
- Project Management







