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Product Engineer

  • OMNIVISION
  • Yokohama, Japan
  • JPY 8,000,000 – JPY 12,000,000

Responsibilities:

  • Product engineer responsible for CMOS image sensor
  • Schedule a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve different technical issues, in order to meet performance requirements.
  • Participate in product definition and provide DFM inputs.
  • Work in close collaboration with silicon foundry, image characterization, and pixel design.
  • Interact with foundry fab in improving all silicon process, color, and package issues.
  • Improve product yield and performance by process optimization and layout design update.
  • Analyze yield and drive corrective actions for yield improvements.
  • Drive characterization to finalize the product datasheet.
  • Work with pixel design group to design the most sophisticated and optimized pixel layout.
  • Collaborate with characterization team to analyze and debug pixel device circuit and various image related issues.
  • Ramp up for image sensors and ASIC devices.
  • Coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes.
  • Work with testing engineers to develop, verify, and release testing program at wafer level testing and final testing.

Qualifications:

  • 5+ years experience with product engineer for semiconductor
  • Knowledge about semiconductor
  • Good communication and inter personal skills (English and Chinese ; business level, Japanese ; conversational level)
  • Result oriented and leading change behaviors
  • Experience / knowledge in CMOS Image Sensor is a plus
  • Project management experience with solid skill is a plus
  • Education: B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Material Science (or equivalent practical experience).

Skills

  • CMOS Image Sensors
  • Semiconductor Process
  • Yield Analysis
  • Characterization
  • DFM
  • Wafer-Level Testing
  • Project Management

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